Industry ni gaw ngang grin ai, katsi ai -hkap la lu ai, hte chemical n-gun n-rawng ai n-gun rawng ai n-gun rawng ai ladat ni hpe ra sharawng ai majaw, ceramic epoxy glue gaw game-galai shai ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai lam hpe ceramic fillers ni a grai n-gun rawng ai n-gun rawng ai lam hte kayau kaya galaw nna, grau nna yak hkak ai jai lang ra ai lam ni hpe hkap la lu na matu paw pru wa sai.
Ceramic epoxy glue gaw, n-gun ja ai alumina, zirconia, shing nrai silica ceramic n-gun ja ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai glue re. Hkam kaja wa ai shaloi, 18 MPa jan ai shear n-gun, laklai ai n-gun (80+ Shore D), hte n-gun ja ai (250℃du hkra), acid, alkali, abrasion, hte hka lim ai hpe grai hkam sharang lu ai, ngang kang ai, n-gun ja ai -density bond hpe shabyin ya ai. Htunghking epoxy glues ni hte n bung ai sha, n-gun n rawng ai hpe yeng seng kau ya lu ai, n-gun n rawng ai hpe ninghkap lu ai, grai sawng ai jak hte n-gun n rawng ai aten hta n-gun n rawng ai hpe makawp maga ya lu ai.
Mungkan ting na ceramic epoxy glue gat lawk gaw grai rawt jat wa nga ai, 2025 ning hta USD wan 1.5 daram manu dan ai rai nna, 2033 ning du wa ai shaloi USD wan 2.5 du wa na re ngu sawn la ai, 6.5% CAGR hte rawt jat wa na re. Madung rawt jat lam a lam ni gaw, n-gun nnan (lithium battery daw ni hpe shingdaw ai lam), electronics (semiconductor hka htung, nbung n-gun jat ai lam), mawdaw (engine daw ni hpe pat da ai, ceramic daw ni hpe shingdaw ai lam), nbungli (sensor hka htung, nbung n-gun hpe shinggrup ai lam), hte bungli galaw ai shara ni hta gram lajang ai lam (ceramic tilening, arung arai ni hpe gram lajang ai lam) ni kaw na ra kadawn ai lam law wa ai lam ni rai nga ai.
Hpaga lam hta, ceramic epoxy glue gaw ahkyak ai machyi makaw ni hpe hparan ya ai. Lithium battery galaw ai hta, ceramic n-gun n rawng ai daw ni hpe shingdaw nna, battery module ni hpe pat da ya ai majaw, nbung katsi ai hpe ninghkap lu nna, electrolyte n pru wa hkra pat shingdang ya lu ai. Electronics hta, thermal interface material langai hku nna magam gun nna, n-gun kaba ai-arung arai ni kaw na katsi ai hpe htawt sit ya ai sha n-ga, wan n-gun hpe mung n-gun jaw ya ai. Industrial gram lajang ai hta, n-gun yawm mat sai ceramic liners ni, magri arung arai ni a n-gun yawm mat ai, hte composite arung arai ni hpe gram lajang ya ai majaw, gram lajang ai aten hpe 3-5 lang jat ya nna gram lajang ai manu hpe mung shayawm ya lu ai.
Hpaga galaw ai ni gaw, lawan ai-hkum tsup ai (25℃hta minit 30), hkrak hkrak shingdaw na matu n-gun n law ai-viscosity, shinggan de jai lang na matu UV-stabilized galaw ai lam ni lawm ai, grau kaja ai tsi ladat ni hte hpaji ningnan ni hpe woi awn nga ai. Hpa majaw nga yang, n-gun ja ai supplier ni gaw, laksan substrates (ceramic, metal, composite) hte bungli galaw ai masa ni hpe hkan nna, laksan hparan ladat ni hpe jaw ya nna, bungli galaw ai lam amyu myu hta kaja dik ai hku galaw lu hkra galaw ya ai.
“Ceramic epoxy glue gaw, hpaga lam hta galaw ai n-gun dat ni hpa hpe lu la mai ai hpe bai masat ya ai” nga nna, n-gun dat galaw ai ningbaw langai a n-gun dat hpaji ninghkring kaba langai tsun ai. "Ndai gaw n-gun atsam, ngang grin ai lam, n hkru n kaja ai makau grup yin ni hpe ninghkap lu ai atsam ni hpe kahkyin gumdin ya ai, high-tech hte heavy industries ni a matu n mai garan kachyan ai multi-functional solution langai mi sha n re."
Hpaga lam ni gaw, akyu rawng ai lam, ngang grin ai lam, kam hpa mai ai lam ni hpe ahkyak shatai ai majaw, ceramic epoxy glue gaw matut nna n-gun ja wa na re. Material science hte formulation optimization hta matut manoi rawt jat wa ai hte maren, grau nna ra kadawn ai application ni a matu ra sharawng ai bonding hparan ladat tai wa na matu jin jin rai nga sai, mungkan ting na hpaga lam garan gachyan ai lam hta hpaji ningnan hte galaw shapraw ai lam hpe shadut ya nga ai.
